Defect analysis

Defect analysis is the process of using industrial computed tomography (ICT) to identify and evaluate internal defects or irregularities in materials or components. ICT enables non-destructive testing by creating high-resolution 3D images of objects.

The first step in defect analysis is to place the object of interest into the CT scanner. The scanner then generates X-rays that pass through the object. The object absorbs a portion of the radiation, while the remaining X-rays reach a detector on the opposite side.

As the object rotates within the CT scanner, multiple X-ray projection images are captured from different angles. These images are then used to create a computer-generated 3D reconstruction of the object. By analyzing this reconstruction, internal defects can be identified and analyzed.

The defects that can be detected using ICT can take various forms, including cracks, voids, inclusions, porosity, discontinuities, delaminations, or material irregularities. The high resolution of ICT allows for the detection of even very small defects that may not be visible to the naked eye or other testing methods.

Once defects are detected, analysis and evaluation take place. The 3D data of the object allows engineers to precisely measure and quantify the size, shape, position, and distribution of the defects. This helps determine the severity of the defect and its potential impact on the functionality, strength, or lifespan of the component.

Defect analysis using ICT finds applications in various industries, including automotive, aerospace, electronics, mechanical engineering, and materials science. It assists in quality assurance, fault diagnosis, material characterization, and optimization of production processes.

Overall, defect analysis through industrial computed tomography enables thorough and accurate examination of objects to detect and evaluate internal defects. This contributes to improving product quality, manufacturing process efficiency, and product safety.